Electronics Cooling is a challenging piece of Circuit Board Technology
Electronics cooling and thermal management are engineering challenges facing industry concerns when it comes to circuit board technology. Recently we came across an interesting product from a company at a trade show: a metal core printed circuit board (PCB) from SinkPAD™ that allows high powered integrated circuit applications to stay cool. The high thermal conductivity path of the metal board allows high power to remain cool due to the superior heat transfer of the board. Light emitting diodes (LED) are ideal candidates for mounting on metal boards. However, their application is not limited to LED’s, but any high powered electronics application.
We will be presenting a white paper within a series of blogs that we will tie together and make available for downloading from our website. This is the first, in the series, describing the SinkPAD™ products.
The increasing heat densities in modern high-power light-emitting diodes (LED) present difficult performance and reliability challenges at the junction of a device, as well as first and second level electrical power-delivery connections. There is also an adverse impact on power efficiency and emission wavelength stability. All means of reducing system thermal impedances must be considered for the successful thermal management of these high-power LED’s. Both the system and board level thermal management practices should come under scrutiny for finding the right balance of performance, cost and reliability.
Engineers at SinkPAD™ are working on addressing the existing shortcomings of widely available MCPCB offerings by developing a board design with an optimized thermal path for the energy dissipated at the diode junction on its way out to the environment. The solution optimizes the heat conduction path at the highest power density location to deliver the most-optimized board level thermal solution.
Licensed Engineers at Glew Engineering are working to demonstrate the improvement by thermal conduction analysis of the optimized SinkPAD™ board and compare it to a standard MCPCB solution. We are hoping to show substantial improvements in board level dependent components of thermal resistance, as well as some of the cost efficiencies that are related.
We will continue to discuss the applications and importance these boards play in electronics cooling technology in our upcoming blogs as well as the white paper.