Thermal Analysis of Espresso Cup Materials (Part 1)

2017-06-05T11:06:56-07:00

Thermal Analysis of Espresso Cup Materials In our blog this week focuses on espresso coffee and the material of the cup in which it is served. The three standard materials that will be tested are paper, Styrofoam and ceramic. Paper cups are designed for cold drinks, so it is likely that they will result in the lowest amount of thermal energy retention in the espresso coffee. Styrofoam cups are designed as a cheaper and single-use alternative to standard ceramic coffee cups. Since they have the ability to handle a large range [...]

Thermal Analysis of Espresso Cup Materials (Part 1)2017-06-05T11:06:56-07:00

Thermal Management Engineering Designs: Semiconductor Chuck Heaters

2017-05-10T16:39:41-07:00

Discussing the engineering constraints, thermal management, and design ideas for chuck heaters used within the semiconductor process.

Thermal Management Engineering Designs: Semiconductor Chuck Heaters2017-05-10T16:39:41-07:00

The Engineer’s Kitchen: Grill Style Panzanella Salad

2018-03-14T10:46:32-07:00

This week in The Engineer's Kitchen, we engineered a Panzanella Salad with Grilled Chicken as a summer lunch.

The Engineer’s Kitchen: Grill Style Panzanella Salad2018-03-14T10:46:32-07:00

Alternative Energy Engineering: Energy from the Earth’s Natural Heat

2018-03-14T10:55:43-07:00

A discussion of utilizing CFD and FEA to perform stress analysis and thermal analysis on turbines that acquire geothermal energy.

Alternative Energy Engineering: Energy from the Earth’s Natural Heat2018-03-14T10:55:43-07:00

Thermal Management: Heat Sink Materials

2018-03-19T11:10:23-07:00

Discussion on materials used in heat sinks and their thermal management properties used by engineers in today's technology.

Thermal Management: Heat Sink Materials2018-03-19T11:10:23-07:00

Electronics Cooling : Thermal Interface Materials

2018-03-19T11:40:47-07:00

Discussion on thermal interface materials used with heat sinks to achieve efficient thermal management solutions for electronics cooling

Electronics Cooling : Thermal Interface Materials2018-03-19T11:40:47-07:00

Electronics Cooling Designs: Thermoelectric Plates

2018-03-19T13:20:39-07:00

Thermoelectric Plates used for thermal management in electronics cooling is discussed from an engineering prospective.

Electronics Cooling Designs: Thermoelectric Plates2018-03-19T13:20:39-07:00

Electronics Cooling Designs: Heat Sinks

2018-04-10T15:11:31-07:00

Heat sinks for electronics cooling and thermal management applications are discussed.

Electronics Cooling Designs: Heat Sinks2018-04-10T15:11:31-07:00

Electronics Cooling Designs: Heat Pipes

2018-03-19T15:33:58-07:00

Discussion on electronics cooling and thermal management using heat pipes in conjunction with heat sinks.

Electronics Cooling Designs: Heat Pipes2018-03-19T15:33:58-07:00

Engineering Energy: Hydroelectric

2018-03-21T12:09:45-07:00

Discussing the engineering of hydroelectric energy and the roles played by mechanical engineers and electrical engineers using CAD and FEA as tools.

Engineering Energy: Hydroelectric2018-03-21T12:09:45-07:00

Metal Core Printed Circuit Board: Part 2

2018-03-21T15:45:40-07:00

Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.

Metal Core Printed Circuit Board: Part 22018-03-21T15:45:40-07:00

Metal Core Printed Circuit Board:Part 1

2018-04-09T13:34:10-07:00

Printed Circuit Boards with metal cores developed by SinkPAD are discussed for the thermal management solutions the provide

Metal Core Printed Circuit Board:Part 12018-04-09T13:34:10-07:00