Stress Analysis in Sports: Prosthetics
The mechanical engineering is discussed regarding prosthetic limbs and how finite element analysis is used in determining there advantages.
The mechanical engineering is discussed regarding prosthetic limbs and how finite element analysis is used in determining there advantages.
Discussing the mechanical engineering that goes into the design of athletic helmets and the stress analysis used in testing.
Stress analysis and mechanical engineering of the athletic shoe is discussed using CAD and computational fluid dynamics
Storing energy discussion from the viewpoint of solar engineering as well as electrical engineering.
Discussing the engineering processes and advancements regarding semiconductors and semiconductor equipment.
A discussion regarding how mechanical engineering is utilized in engineering for floods and what some engineering firms are developing.
Mechanical engineering and electrical engineering discussed in regards to flood damage after a hurricane.
Continued discussion on engineering designs for thermal management in electronics cooling
Discussion on thermal interface materials used with heat sinks to achieve efficient thermal management solutions for electronics cooling
Electronics Cooling : Thermal Interface Materials Read More »
Heat sinks for electronics cooling and thermal management applications are discussed.
Discussion on electronics cooling and thermal management using heat pipes in conjunction with heat sinks.
Discussion on Automation and the role played by mechanical engineers and electrical engineers utilizing tools such as CAD.
Discussing the engineering of hydroelectric energy and the roles played by mechanical engineers and electrical engineers using CAD and FEA as tools.
Mehanical engineers along with Electrical engineers use CAD and FEA to help design better and more efficient designs in the wind energy field.
FEA, CAD, and CFD are discussed in relation to computer aided engineering and their benefits.
CAD / CAM process and software within the mechanical engineering field is discussed.
Engineering Tools in the 21st Century Part 4: CAD to CAM Read More »
Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.
Discussion of the fundamentals of glass fracturing and the part Finite Elemental Analysis and Mechanical Engineering play in the analysis.
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
Electronics Cooling and Thermal Management: PCB Part 2 Read More »
Optomechanical engineers, using finite element analysis, FEA, can address issues with thermal management, shock and vibration.
Optomechanical Engineering: Benefits of Finite Element Analysis Read More »