## Thermal Expansion in a Glass and Aluminum Window: Part 2

2018-02-20T13:29:14+00:00

Figure 1: Simplified model of an aluminum-glass window   In last week’s blog, Thermal Expansion in a Glass and Aluminum Window: Part 1, we introduced the basic concept of thermal expansion in solid materials.  Since CTE mismatch can impose extremely high stress, during mechanical engineering design one must consider the temperature exposure and expansion or contraction of a material.  In order to help the read gain insight, we used a simplified aluminum-framed window to demonstrate that a hot summer day would be enough to shatter glass if the window wasn’t equipped with a flexible gasket between the frame and the glass.  For this entry, we utilize a finite element analysis (FEA) to elucidate the stress effects caused by both high and [...]

Thermal Expansion in a Glass and Aluminum Window: Part 2 2018-02-20T13:29:14+00:00

## Thermal Expansion in a Glass and Aluminum Window: Part 1

2018-02-21T10:38:23+00:00

Equipment designers must accommodate thermal expansion (CTE)of dissimilar materials, especially when they are subject to large temperature changes.  This problem is often called "CTE mismatch."  In this blog, we give the fundamentals of thermal expansion calculations used in thermo-mechanical analysis. These calculations are simple but useful, and easy enough to perform by hand or with a spread sheet. For more complicated shapes, one must use computer modeling.  As an example, we perform a finite element analysis (FEA) in a later blog http://glewengineering.com/thermal-expansion-in-a-glass-and-aluminum-window-part-2/, of a glass and aluminum window and frame to show where the stress is excessive.  This points to the obvious need for a gasket to perform as a thermal interface material, in order to lessen [...]

Thermal Expansion in a Glass and Aluminum Window: Part 1 2018-02-21T10:38:23+00:00

## IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards

2018-02-12T17:17:57+00:00

IC Thermal Management discussion regarding the heat sink and thermal interface materials.

IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards 2018-02-12T17:17:57+00:00

## LED Lighting: Part 2, First Level Connection Challenges in LEDs

2017-05-19T14:39:59+00:00

In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.

LED Lighting: Part 2, First Level Connection Challenges in LEDs 2017-05-19T14:39:59+00:00