Thermal Expansion in a Glass and Aluminum Window: Part 2

By | 2017-08-12T16:31:30+00:00 March 17th, 2016|Finite Element Analysis, Materials Science, Mechanical Engineering, Thermal Management|

Figure 1: Simplified model of an aluminum-glass window   In last week’s blog, Thermal Expansion in a Glass and Aluminum Window: Part 1, we introduced the basic concept of thermal expansion in solid materials.  Since CTE mismatch can impose extremely high stress, during mechanical engineering design one must consider the temperature exposure and expansion or contraction of a material.  In order to help the read gain insight, we used a simplified aluminum-framed window to demonstrate that a hot summer day would be enough to shatter glass if the window wasn’t equipped with a flexible gasket between [...]

Thermal Expansion in a Glass and Aluminum Window: Part 1

By | 2017-11-08T15:17:20+00:00 March 12th, 2016|Finite Element Analysis, Materials Science, Mechanical Engineering|

Equipment designers must accommodate thermal expansion (CTE)of dissimilar materials, especially when they are subject to large temperature changes.  This problem is often called "CTE mismatch."  In this blog, we give the fundamentals of thermal expansion calculations used in thermo-mechanical analysis. These calculations are simple but useful, and easy enough to perform by hand or with a spread sheet. For more complicated shapes, one must use computer modeling.  As an example, we perform a finite element analysis (FEA) in a later blog //glewengineering.com/thermal-expansion-in-a-glass-and-aluminum-window-part-2/, of a glass and aluminum window and frame to show where the stress is [...]

LED Lighting: Part 2, First Level Connection Challenges in LEDs

By | 2017-05-19T14:39:59+00:00 February 27th, 2012|Materials Science, Mechanical Engineering, Semiconductor, Thermal Management|

In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.