Engineering firms and how a complete team is utilized in 21st century industry.
Finite element analysis (FEA) and CAD are discussed as just a couple of the tools made available to Licensed Engineers today.
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.
IC thermal management, Hot Spots, and underfill glass transition temperature are discussed.
IC Thermal Management discussion regarding heat transfer and heat spreaders.
IC thermal management introduction. This relates to the heat transfer problems encountered by an electrical engineer in semiconductor design.