IC thermal management introduction. This relates to the heat transfer problems encountered by an electrical engineer in semiconductor design.
Finite element analysis (FEA) and CAD are discussed as just a couple of the tools made available to Licensed Engineers today.
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.
IC Thermal Management discussion regarding the heat sink and thermal interface materials.
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.
IC Thermal Management discussion regarding heat transfer and heat spreaders.