Engineering Tools in the 21st Century Part 1: Utilizing CAD and FEA

By | 2017-05-18T15:37:29+00:00 May 24th, 2012|CAD, Electrical Engineering, Engineering Consulting, Mechanical Engineering|

Finite element analysis (FEA) and CAD are discussed as just a couple of the tools made available to Licensed Engineers today.

Electronics Cooling and Thermal Management: PCB Part 2

By | 2017-05-18T15:52:41+00:00 May 7th, 2012|Electrical Engineering, Mechanical Engineering, Thermal Management|

Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.

IC Thermal Management: Electronic systems reliability & power cycling

By | 2017-05-24T16:44:11+00:00 December 9th, 2011|Electrical Engineering, Mechanical Engineering, Thermal Management|

Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.

IC Thermal Management Part 3: Underfill TG

By | 2017-06-08T15:55:29+00:00 November 23rd, 2011|Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor, Thermal Management|

IC thermal management, Hot Spots, and underfill glass transition temperature are discussed.

Introduction to IC Thermal Management and heat transfer

By | 2017-06-09T11:36:44+00:00 July 11th, 2011|Mechanical Engineering, Semiconductor, Thermal Management|

IC thermal management introduction. This relates to the heat transfer problems encountered by an electrical engineer in semiconductor design.