Metal Core Printed Circuit Board: Part 2

2018-03-21T15:45:40+00:00

Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.

Metal Core Printed Circuit Board: Part 2 2018-03-21T15:45:40+00:00

Metal Core Printed Circuit Board:Part 1

2018-04-09T13:34:10+00:00

Printed Circuit Boards with metal cores developed by SinkPAD are discussed for the thermal management solutions the provide

Metal Core Printed Circuit Board:Part 1 2018-04-09T13:34:10+00:00

Electronics Cooling and Thermal Management: PCB Part 2

2018-03-19T14:04:54+00:00

Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.

Electronics Cooling and Thermal Management: PCB Part 2 2018-03-19T14:04:54+00:00

IC Thermal Management Part 5 Thermal Interface Materials

2018-03-29T10:58:26+00:00

IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.

IC Thermal Management Part 5 Thermal Interface Materials 2018-03-29T10:58:26+00:00

IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards

2018-02-12T17:17:57+00:00

IC Thermal Management discussion regarding the heat sink and thermal interface materials.

IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards 2018-02-12T17:17:57+00:00

LED: Second Level Connection Challenges

2018-03-22T10:30:07+00:00

LED lighting and second level connection challenges as they pertain to thermal management and optimizing the thermal path.

LED: Second Level Connection Challenges 2018-03-22T10:30:07+00:00

Printed Circuit Boards Part 1: Printed Circuit Board Basics

2018-03-22T10:38:24+00:00

Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.

Printed Circuit Boards Part 1: Printed Circuit Board Basics 2018-03-22T10:38:24+00:00

LED Lighting: Part 2, First Level Connection Challenges in LEDs

2017-05-19T14:39:59+00:00

In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.

LED Lighting: Part 2, First Level Connection Challenges in LEDs 2017-05-19T14:39:59+00:00

Finite Element Analysis: Weight Optimization for Optical Systems

2017-05-19T14:52:17+00:00

Optomechanical engineers use flexures to design optical systems to absorb thermal, stress, shock loads and weight issues.

Finite Element Analysis: Weight Optimization for Optical Systems 2017-05-19T14:52:17+00:00

LED Lighting: “Daylight, Now in a Headlight”

2017-05-19T14:57:10+00:00

LED lighting used in Audi’s Superbowl commercial showcased their headlights. Mechanical engineers address LED engineering issues, thermal management.

LED Lighting: “Daylight, Now in a Headlight” 2017-05-19T14:57:10+00:00

IC Thermal Management: Electronic Systems Reliability & AMP; Power Cycling

2017-12-06T15:03:30+00:00

Thermal Management as it relates to electronics reliability due to power cycling and its place in semiconductor reliability.

IC Thermal Management: Electronic Systems Reliability & AMP; Power Cycling 2017-12-06T15:03:30+00:00