Thermal Analysis of Espresso Cup Materials (Part 1)

2017-06-05T11:06:56+00:00

Thermal Analysis of Espresso Cup Materials In our blog this week focuses on espresso coffee and the material of the cup in which it is served. The three standard materials that will be tested are paper, Styrofoam and ceramic. Paper cups are designed for cold drinks, so it is likely that they will result in the lowest amount of thermal energy retention in the espresso coffee. Styrofoam cups are designed as a cheaper and single-use alternative to standard ceramic coffee cups. Since they have the ability to handle a large range of temperatures, they will be able to manage the thermal energy in the espresso coffee. Ceramic cups are designed to handle extremely hot temperatures and then be washed [...]

Thermal Analysis of Espresso Cup Materials (Part 1) 2017-06-05T11:06:56+00:00

Thermal Management Engineering Designs: Semiconductor Chuck Heaters

2017-05-10T16:39:41+00:00

Discussing the engineering constraints, thermal management, and design ideas for chuck heaters used within the semiconductor process.

Thermal Management Engineering Designs: Semiconductor Chuck Heaters 2017-05-10T16:39:41+00:00

Alternative Energy Engineering: Energy from the Earth’s Natural Heat

2017-05-10T16:54:32+00:00

A discussion of utilizing CFD and FEA to perform stress analysis and thermal analysis on turbines that acquire geothermal energy.

Alternative Energy Engineering: Energy from the Earth’s Natural Heat 2017-05-10T16:54:32+00:00

Electronics Cooling and Thermal Management: PCB Part 2

2017-05-18T15:52:41+00:00

Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.

Electronics Cooling and Thermal Management: PCB Part 2 2017-05-18T15:52:41+00:00

IC Thermal Management Part 5 Thermal Interface Materials

2018-02-09T10:49:19+00:00

IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.

IC Thermal Management Part 5 Thermal Interface Materials 2018-02-09T10:49:19+00:00

IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards

2018-02-12T17:17:57+00:00

IC Thermal Management discussion regarding the heat sink and thermal interface materials.

IC Thermal Management Part 4 Thermal Interface Material Use in Printed Circuit Boards 2018-02-12T17:17:57+00:00

LED Lighting: Part 2, First Level Connection Challenges in LEDs

2017-05-19T14:39:59+00:00

In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.

LED Lighting: Part 2, First Level Connection Challenges in LEDs 2017-05-19T14:39:59+00:00