Discussing the engineering constraints, thermal management, and design ideas for chuck heaters used within the semiconductor process.
A discussion of utilizing CFD and FEA to perform stress analysis and thermal analysis on turbines that acquire geothermal energy.
Discussion on materials used in heat sinks and their thermal management properties used by engineers in today's technology.
Discussion on thermal interface materials used with heat sinks to achieve efficient thermal management solutions for electronics cooling
Electronics Cooling presenting synthetic jets. Part of a series on different types of electronics cooling and thermal management methods.
Engineering discussion on Electrostatic Fluid Accelerators (EFA) and their effects on electronics cooling and thermal management
Thermoelectric Plates used for thermal management in electronics cooling is discussed from an engineering prospective.
Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.
Printed Circuit Boards with metal cores developed by SinkPAD are discussed for the thermal management solutions the provide
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.
Optomechanical engineers use flexures to design optical systems to absorb thermal, stress, shock loads and weight issues.
LED lighting used in Audi’s Superbowl commercial showcased their headlights. Mechanical engineers address LED engineering issues, thermal management.