Thermal Analysis of Espresso Cup Materials In our blog this week focuses on espresso coffee and the material of the cup in which it is served. The three standard materials that will be tested are paper, Styrofoam and ceramic. Paper cups are designed for cold drinks, so it is likely that they will result in the lowest amount of thermal energy retention in the espresso coffee. Styrofoam cups are designed as a cheaper and single-use alternative to standard ceramic coffee cups. Since they have the ability to handle a large range of temperatures, they will be able to manage the thermal energy in the espresso coffee. Ceramic cups are designed to handle extremely hot temperatures and then be washed [...]
Discussing the engineering constraints, thermal management, and design ideas for chuck heaters used within the semiconductor process.
A discussion of utilizing CFD and FEA to perform stress analysis and thermal analysis on turbines that acquire geothermal energy.
Discussion on thermal interface materials used with heat sinks to achieve efficient thermal management solutions for electronics cooling
Electronics Cooling presenting synthetic jets. Part of a series on different types of electronics cooling and thermal management methods.
Thermoelectric Plates used for thermal management in electronics cooling is discussed from an engineering prospective.
Electronics cooling and thermal management is discussed in predicting temperature evolution in printed circuit boards and electronic devices.
Electronics cooling and thermal management for PCB and IC, using heat sinks and finite element analysis by mechanical engineers.
IC thermal Management scenario where there is no integrated heat spreader and the chip is directly coupled to the heat sink.
IC Thermal Management discussion regarding the heat sink and thermal interface materials.
Printed Circuit Board design information which include routing, electronics thermal management, SPICE models and more.
In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.