Series on Semiconductor Processing and Integrated Circuits, Part 1: Wire Bonding vs Chip Bonding

By | 2017-05-26T11:42:54+00:00 February 3rd, 2014|Mechanical Engineering, Semiconductor|

Semiconductor packaging, one of the final phases of semiconductor processing, is explored.

‘Green Light’ in Greenland Lends Hope For Rare Earth Mining

By | 2017-05-10T12:34:04+00:00 October 28th, 2013|Materials Science, Safety, Semiconductor|

A discussion over the mining availabilityof rare earth elements in Greenland and what it means to the semiconductor and engineering industries

Thermal Management Engineering Designs: Semiconductor Chuck Heaters

By | 2017-05-10T16:39:41+00:00 June 14th, 2013|Mechanical Engineering, Semiconductor, Thermal Management|

Discussing the engineering constraints, thermal management, and design ideas for chuck heaters used within the semiconductor process.

LED Lighting: Part 2, First Level Connection Challenges in LEDs

By | 2017-05-19T14:39:59+00:00 February 27th, 2012|Materials Science, Mechanical Engineering, Semiconductor, Thermal Management|

In first level connections, mechanical engineers’ main responsibility is connecting a chip to an intermediate package, also known as a substrate.

IC Thermal Management Part 3: Underfill TG

By | 2017-06-08T15:55:29+00:00 November 23rd, 2011|Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor, Thermal Management|

IC thermal management, Hot Spots, and underfill glass transition temperature are discussed.

Introduction to IC Thermal Management and heat transfer

By | 2017-06-09T11:36:44+00:00 July 11th, 2011|Mechanical Engineering, Semiconductor, Thermal Management|

IC thermal management introduction. This relates to the heat transfer problems encountered by an electrical engineer in semiconductor design.

EDAMethodology Perl Script for Verilog File to List the Pin Signals

By | 2018-01-03T10:00:58+00:00 June 1st, 2011|Mechanical Engineering, Semiconductor|

It is not very often that an organization is willing to give something away for free but that is what Glew Engineering is doing right now Below is